HYDRIDE Q RESIN
- CAS NO.：68988-57-8
- Empirical Formula: C10H26ClO4Si2*
- Molecular Weight: 301.93504
- MDL number: MFCD01323580
- EINECS: 273-531-0
- Update Date: 2025-12-17 09:50:05
What is HYDRIDE Q RESIN?
The Uses of HYDRIDE Q RESIN
HYDRIDE Q RESIN is used as Surface treating agent for the surface of organic silicon pressure sensitive adhesive, mobile keypads and epoxy adhesives, etc. Reinforced-filling: Used for RTV rubber, HTV rubber, addition type liquid silicone rubber, heat-vulcanizing silicone rubber, silicone rubber compounds and shell-less encapsulation of semiconductor components. Adhesive: Used for construction sealant and silicone resin coatings. Other additive: Such as preparing release agent, antifoaming agent, anti-sticking agent, brightening agent and conditioning agent on peel strength of addition type anti-sticking agent. Avoid contact with: strong acids, strong bases and strong oxidizing agents.
Properties of HYDRIDE Q RESIN
| Density | 0,94 g/cm3 |
| refractive index | 1.41 |
| Specific Gravity | 0.94 |
| EPA Substance Registry System | Silicic acid (H4SiO4), tetraethyl ester, reaction products with chlorodimethylsilane (68988-57-8) |
Safety information for HYDRIDE Q RESIN
Computed Descriptors for HYDRIDE Q RESIN
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