Copper Bimetallic Plates
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- Time:0001-01-01
Product Details
- Product NameCopper Bimetallic Plates
- MW0
Elongation: 27-38 %
Density: 3.8 g/cm3
Hardness: H24 (half hard)
Material Grade: Copper T2
Peeling Strength: More Than 12 N/mm
Ratio For Copper Weight: 45%
Ration For Copper Volume: 20%
Resistivity: Less Than 0.019 Ohm mm2/m)
Copper Purity: 99.9%min
Tensile Strength: More Than 120 N/mm2
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